Electron Beam Lithography | Excimer UV Cleaner (for wafer)

SB-89010EUVC Excimer UV Cleaner (for wafer)

SB-89010EUVC Features

6 inch wafer loadable
Wafer surface cleaning before resist coating
Removal of organic matter from wafer surface
Improve adhesion between resist and wafer (*depending on the type of resist or developer, adhesion may not improve).

The Excimer UV Cleaner can eliminate contamination caused by organic substances on the wafer surface, by using UV light with a wavelength of 172 nm emitted from xenon (Xe) excimers.

Removal of Resist Scum

By performing a cleaning step before the etching process, any resist scum remaining on the wafer surface can be removed.

Before cleaning

400 nm thick positive resist

After cleaning

Irradiated for 20 minutes

SB-89010EUVC Specifications

Irradiated UV light			Wavelength 172 nm
Maximum specimen size			W 152.4 mm × D154.2 mm ×H 60 mm
Maximum specimen mass			1 kg
Irradiation time setting			10 seconds to 99 minutes
Vacuum pump			Diaphragm type dry vacuum pump
Installation requirements	Power		Single phase, 90 to 110 V AC, 50/60 Hz, 500 VA
	Dimensions and weight (cables and vacuum pipes not included)	Main unit	43 cm (W) × 44 cm (D) × 31 cm (H), approximately 22 kg
		Vacuum pump	17 cm (W) × 33 cm (D) × 20 cm (H), approximately 8 kg
	Room temperature		15 to 30 ℃
	Humidity		60% (RH) or less (no condensation)
Regular replacement parts (replace them every time cumulative irradiation time reaches 1000 hours)			UV lamp, vacuum gauge, O-ring, etc.