Fast High-Quality TEM Sample Preparation
The new FIB stage offers fast transitioning between processing and imaging, providing real-time feedback of specimen quality. With the ability to prepare samples thinner than 30nm, the FIB-SEM enables superior atomic resolution imaging and analysis with STEM and TEM. A retractable STEM detector enables simultaneous acquisition of bright field and dark field images to precisely evaluate preparation of the TEM sample.
New Large Chamber/Stage for Ultimate Flexibility
The FIB’s large specimen chamber with easy-access door and easily accessible stage allows an efficient workflow and flexibility for a variety of samples and processes. The 5-axis full-eucentric large motor stage supports large samples and is designed for a wide range of XY travel and stage tilt and rotation.
New FIB Column with higher current and superior performance at low kV
The high current (up to 100 nA) FIB column is especially effective for large-area milling and analysis, ideal for semiconductor samples. The new FIB has high performance fine milling capabilities essential for quality lamella preparation for imaging, EDS analysis, and 3D microscopy. The new JIB-PS500i is designed for superior performance in the low kV range, as low as 0.5kV, essential for beam sensitive materials.
Robust Workflow with TEM-Linkage
A new high-throughput, robust workflow from specimen preparation to TEM imaging. TEM-Linkage consists of a double tilt cartridge and TEM holder that facilitates transfer of samples directly from the FIB to the TEM.