High-throughput electron diffraction workflows with the XtaLAB Synergy-ED
Jessica E. Burch, Rigaku | Tuesday, August 4 | 12:00 PM - 1:00 PM
Microcrystal electron diffraction has been established as a cutting-edge technique for the structural elucidation of diverse nanocrystalline materials. With thousands of crystallites available on a grid, electron diffraction analysis routinely enables the identification of multiple compounds, crystalline phases, or trace contaminants within a single sample; however, fully automated workflows are critical for its practical implementation in the analysis of complex samples. Herein, we discuss our latest developments in high-throughput data collection and analysis using the XtaLAB Synergy-ED electron diffractometer, developed jointly by JEOL Ltd. and Rigaku Corporation. These developments include AI-driven grain selection and automated energy-dispersive X-ray spectroscopy measurements, seamlessly integrated into CrysAlisPro-ED to improve efficiency and ease of use. Representative examples will be presented to demonstrate these capabilities.
Automated workflows for FIB, S/TEM Imaging and Analytical Analysis of Advanced Semiconductor Devices
Noureddine Anibou, JEOL USA | Wednesday, August 5 | 12:00 PM - 1:00 PM
As semiconductor devices continue to scale, with greater inherent complexity, beyond the 3nm node, the need for high throughput FIB sample prep for atomic resolution TEM/STEM imaging and analysis has increased dramatically. This ramp up is driving vendors to provide automated workflows that reduce the time and skill necessary to handle this dramatic increase. Every step of the process, from FIB sample preparation to atomic resolution TEM/STEM imaging and analytical results for metrology and defect characterization for Yield enhancement and production support has never been more critical.
This session will showcase JEOL's integrated workflow, highlighting the JIB-PS500i FIB-SEM & JEM-ACE200 200kV FE Cs corrected high speed analytical S/TEM. The JIB-PS500i utilizes a high-speed preparation technique called STEMPLING for automated lamella preparation and when combined with the JEM-ACE200, for automated lamella analysis (Automation Center SW), FABs gain increased throughput with a streamlined, reproducible solution for semiconductor failure analysis and process characterization. Attendees will learn how automation minimizes operator variability, enables unattended multi-site specimen preparation, simplifies instrument-to-instrument transfer, and accelerates high-throughput S/TEM imaging and analysis.
The presentation will highlight how an end-to-end automated workflow improves productivity, consistency, and overall laboratory efficiency while allowing scientists to focus on data interpretation rather than repetitive microscope operations.