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Large area planar surface milling for 30mm diameter processing and minimizing curtaining effect
Large area planar surface milling for 30mm diameter processing and minimizing curtaining effect

Applications note IB2025-01

Planar surface milling is a sample sputtering method of continuously rotating a sample while irradiating an Ar ion beam at an adjusted irradiation angle. This method is mainly used as a finishing process for samples that have already been mirror-polished by mechanical polishing and is effectively applied in SEM observation and EBSD analysis.

While the processing range of mechanical polishing is typically 10mm Ø or larger, the sputtering range of conventional planar surface milling is about 5mm Ø. Therefore, there is a growing demand for expanding the sputtering range. However, there are technical challenges associated with expanding this range. In this study, we have explored a new approach to address these challenges.

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