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  • Intuitive, point and shoot operation
  • Fully automated, fast imaging and analysis
  • Powerful performance at your fingertip
  • Large specimen chamber


  • Pristine cross sections for observing voids and fractures
  • Ideal preparation for EBSD analysis
  • Wide area cross sections

EDS of cross section of wire bond

Ductile and brittle fracture with an inclusion
Courtesy of Sheri Neva, EAG

EDS of cross section of lithium battery

Fracture in wire bond


EBIC imaging of semiconductor device

Failure Analysis

The Electron Microscope is an invaluable tool for determining the causes of failure in a wide variety of materials. JEOL Scanning Electron Microscopes (SEM) and Transmission Electron Microscopes (TEM) offer several advantages for high throughput imaging and analysis.

Mass spectrometry is one of the most sensitive and specific methods for identifying contaminants and unknown materials. JEOL time-of-flight mass spectrometers are the ideal complement to our electron optic products for solving tough analytical problems.

Failure Analysis

Advantages of the JEOL SEM in Failure Analysis

  • High spatial resolution
  • Large depth of field
  • Correlative analysis with fast navigation
  • Multiple analytical capabilities - EDS, WDS, CL, EBSD, Micro-CT
  • Large specimen chamber for nondestructive observation
  • In situ stage for easy handling of large irregular samples
  • In situ dynamic testing, heating, cooling, EBIC, and nano-manipulation
  • LV including extended pressure for imaging samples "as received"
  • High throughput
  • Easy to use GUI
  • Tensile testing and fatigue analysis

The in chamber stage allows secure positioning of irregular-shaped and large-size samples.

FE SEM for Failure Analysis

Tungsten SEM for Failure Analysis

Advantages of the JEOL TEM in Failure Analysis

  • Atomic resolution
  • Structural analysis with bright field and dark field imaging
  • Elemental and crystallographic analysis
  • Chemical analysis
  • Large solid angle EDS, EELS

TEM for Failure Analysis

Mass Spectrometry for Failure Analysis

JEOL offers three unique mass spectrometry solutions for failure analysis of electronics and manufactured devices. Sample applications include:

Direct analysis of adhesives and polymers using AccuTOF-DART (ambient ionization)

Mass Spec imaging of contamination on OLED panels using SpiralTOF (MALDI-TOF/TOF)

Pyrolysis GC/HRMS analysis of resin using AccuTOF-GCx (GC/TOFMS)

Advantages of JEOL Cross Section Polisher in Failure Analysis

  • Wide area cross sections
  • No exposure to oil or water during milling
  • No smearing, crumbling, or distortion of fragile, porous samples
  • Works equally well for hard, soft, and composite materials
  • Creates pristine cross sections for observing voids and fractures
  • Ideal preparation for EBSD analysis
  • No embedding required

Cross Section Polisher