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SEM manufacturers can choose different output sizes for their images, making magnification a very deceptive number when comparing SEM micrographs from different SEM manufacturers. Because of this fact, the best way to compare images is to compare the length of the micron bar or field of view.

There are a number of applications where scientists and engineers are faced with air or moisture sensitive samples that require imaging and analysis using a scanning electron microscope (SEM). Applications include: components in rechargeable batteries, fuel cells, and catalysts among others. Any exposure to oxygen or moisture in the air can completely alter or destroy the structure of these highly reactive materials. JEOL has built a special air-lock system that can handle the transfer of air-sensitive specimens to be imaged in the SEM without atmospheric exposure.

The ability to increase the probe current for fast microanalysis, while still maintaining a small spot size and small volume of excitation for high resolution, has been the holy grail of microanalysis in SEM. One of the unique features of JEOL’s FE-SEMs is the patented Aperture Angle Control Lens (ACL). This lens automatically optimizes for both high resolution imaging at low probe currents and high spatial resolution X-ray analysis at high probe currents with a seamless transition between the two.

The holy grail of nanoscale analysis with EDS is to quickly analyze any features which can be imaged in the SEM. However, for nanoscale features this is complicated by that fact that X-ray spatial resolution is typically larger than SEM imaging resolution. Figure 1 shows EDS maps from an integrated circuit cross section at 15kV and 6kV using a W SEM and an FE SEM, as well as the approximate X-ray signal depths at those voltages.

In recent years with the advances in both EBSD and FE-SEM technology there have been renewed efforts at analyzing nanostructured materials at high temperatures using dedicated specimen holders and sub-stages. Although the techniques for EBSD analysis of bulk materials using heating stages have been well established [1], the requirements for nanostructured materials preparation and analysis obviously differs from bulk materials and can benefit from a miniaturized heater with smaller sample/higher temperature capacity capability [2].

Electron Backscatter Diffraction (EBSD) is a powerful technique capable of characterizing extremely fine grained microstructures in a Scanning Electron Microscope (SEM). Electron Backscatter Patterns (EBSPs) are generated near the sample surface, typically from a depth in the range 10 – 50nm. In order to achieve effective analysis it is imperative to combine high beam current with small probe size to achieve high spatial resolution in a time efficient manner.

Utilizing Monte Carlo Modeling of electron trajectories Electron Flight Simulator is a software tool designed to make your job easier. It can help you understand difficult samples, show the best way to run an analysis, and help explain results to others. With it you can see how the electron beam penetrates your sample, and where the X-ray signal comes from, for a wide variety of microscope conditions. You can model multiple layers, particles, defects, inclusions, and cross-sections. Any sample chemistry can be modeled.

JEOL SEMs are delivered with the capability for remote viewing and remote operation. The SEM computer includes a 2nd ethernet card for connection to your local area network. There is no need for a second support computer. Just connect your JEOL SEM computer to a reliable and fast broadband internet connection and choose the software platform that meets your remote access requirements.

JSM-IT700HR Product Brochure

JEOL’s large chamber SEMs are designed for easy access in both the Tungsten SEM and Thermal Schottky Field Emission SEM models. Our large, direct-access sample chambers are ideal suited for the labs that require high-throughput and multi-sample imaging and analysis, multiple ports to fit a variety of accessories, and analysis of large samples that cannot be cut to size.

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