Analytical Instrument Documents


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Analysis of Reaction Gases in a PECVD Chamber: Reaction Analysis using a High-Resolution Mass Spectrometer

Plasma-enhanced chemical vapor deposition (PECVD) is an evaporation technique that forms various thin films on a substrate using a material gas in a low-vacuum chamber. PECVD, which decomposes the material gas via plasma, is widely used to develop silicon, silicon oxide, and silicon nitride films in semiconductor device fabrication.

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Other Resources

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Corona - Glow Discharge (DART Ion Source)

February 22, 2020